Removal and characterization of focused-ion-beam-induced damaged layer on single crystal diamond surface and application to multiple depth patterning

Keyphrases

• Focused Ion Beam 100%
• Damaged Layer 100%
• Single Crystal Diamond 100%
• Diamond Surface 100%
• Multiple Depths 100%
• Ion Beam Irradiation 50%
• Diamond 50%
• Depth Structure 33%
• Processing Temperature 33%
• Ion Energy 16%
• Heating Time 16%
• Ion Fluence 16%
• Heating Condition 16%
• Etch Characteristics 16%
• Etching Rate 16%
• Ion-ion 16%
• Ion Heating 16%
• Defect Density 16%
• Range Rate 16%
• Nanometre 16%
• Depth Range 16%
• Pattern-based Approach 16%
• Removal Depth 16%
• Process Heating 16%
• Etching Depth 16%
• Beam Conditions 16%

Engineering

• Focused Ion Beam 100%
• Damaged Layer 100%
• Diamond Crystal 100%
• Beam Irradiation 50%
• Diamond Phase 50%
• Diamond 33%
• Structure Depth 33%
• Ion Energy 16%
• Nanometre 16%
• Etch Rate 16%
• Heating Time 16%
• Temperature Time 16%
• Defect Density 16%
• Patterning Method 16%