Project Details
Abstract
The powder of supersaturated solid solution of Al-7.8at%Ti-0.3at%Fe with a nanocrystalline, prepared by MA,was compacted to columnar shape material at low temperature by application of high pressure of 3GPa. Diffusion of copper was studied in this compacted nanocrystalline material using and ion mass microanalyzer. The interfacial diffusion coefficient of copper in the nanocrystalline materials is fairly higher than the volume diffusion coefficient of copper in aluminum, and the activation energy of the interfacial dirrusion is quite small when compared with that of volume diffusion of copper in aluminum.
Status | Finished |
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Effective start/end date | 1996/01/01 → 1997/12/31 |
Funding
- Japan Society for the Promotion of Science: ¥2,200,000.00
Keywords
- メカニカルアロイング
- 非平衡相
- アモルファス
- Al-Ti-X系合金
- 超高圧・低温固化成形
- ナノ結晶
- 熱安定性
- 拡散
- 強制固溶体
- 高圧・低温 固化成形
- Mechanical Allying
- Al-Ti-X Alloy
- Non Equilibrium Phase
- Amorphous
- Nano-Crystal
- Consolidation at Low Temperature and Ultra High Pressure
- Diffusion
- Thermal Stability