Low-loss characteristics of coplanar waveguides fabricated by directly bonding metal foils to high-resistivity Si substrates

Kenya Yonekura, Tasuku Kawamoto, Jianbo Liang, Eiji Shikoh, Koichi Maezawa, Naoteru Shigekawa

研究成果: ジャーナルへの寄稿学術論文査読

3 被引用数 (Scopus)

抄録

Coplanar waveguides (CPWs) are fabricated by directly bonding 17 μm Al foils to Si substrates with different resistivities and wet etching. Their RF characteristics are compared with those of CPWs fabricated on 0.8 μm thick evaporated Al layers. A lower insertion loss is observed for Si substrates with higher resistivity irrespective of the thickness of conductors because the substrate loss is decreased. For a 10000-ω · cm Si substrate, Al-foil-based CPWs reveal a a1/40.7 dB cm-1 lower insertion loss in comparison with evaporated-Al-based CPWs at 1 GHz. These features agree with the calculation, which implies the superiority of direct bonding of metal foils for realizing low-loss passive components.

本文言語英語
論文番号SF1008
ジャーナルJapanese Journal of Applied Physics
61
DOI
出版ステータス出版済み - 2022/06

ASJC Scopus 主題領域

  • 工学一般
  • 物理学および天文学一般

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