IMPROVEMENT OF LOW DUCTILITY FAILURE IN COPPER.

The effects of zinc addition and reduction of sulfur on low ductility failure in copper have been investigated. With increasing zinc content up to 3. 3%, the low ductility failure in copper was alleviated, but it was accelerated with the further addition of zinc. The most effective alleviation was obtained in a Cu-1. 2%Zn alloy. The low ductility failure in copper was attributed to the formation of large voids at grain boundaries. A proper amount of zinc addition to copper suppressed the grain boundary sliding which causes the formation of voids. The addition of about 10% zinc to copper accelerated coarse slips which cause the void formation at the intersections of slip bands with grain boundaries.