Effect of underpotential deposition (UPD) of copper on oxygen reduction at Pt(111) surfaces

Takayuki Abe, Greg M. Swain, Kenji Sashikata, Kingo Itaya*

*この論文の責任著者

研究成果: ジャーナルへの寄稿学術論文査読

85 被引用数 (Scopus)

抄録

The influence of underpotentially deposited Cu adlayers on the electrocatalytic reduction of oxygen at Pt(111) has been studied in 0.05 M H2SO4 solutions using hanging meniscus rotating-disk (HMRD) voltammetry and electrochemical scanning tunneling microscopy (STM). Oxygen reduction at clean bare Pt(111) proceeds by a direct four-electron transfer with the formation of H2O as the primary reaction product. After the formation of the first underpotentially deposited Cu adlayer with (√3 × √3)R30° structure, the oxygen reduction current decreases to a steady-state value which is almost half that observed at bare Pt. This partial inhibition provided by the Cu adatoms can be explained by a change in the oxygen adsorption mechanism from the bridged orientation, favoring a four-electron transfer, to the end on orientation, favoring a two-electron transfer. The effect of coadsorbed halides on underpotential deposition (UPD) as well as the oxygen reduction reaction, has also been examined. Oxygen reduction at Cu-modified Pt(111) in the presence of chloride was completely inhibited after the first UPD process. Further, oxygen reduction in a pure H2SO4 solution on bare Pt(111) was carefully studied using HMRD voltammetry. The oxygen reduction current at 0.02 V was almost half the constant limiting current observed in the potential region between 0.5 and 0.3 V. This result can also be explained by a change in the oxygen adsorption mechanism from the bridged to the end-on orientation.

本文言語英語
ページ(範囲)73-83
ページ数11
ジャーナルJournal of Electroanalytical Chemistry
382
1-2
DOI
出版ステータス出版済み - 1995/02/07

ASJC Scopus 主題領域

  • 分析化学
  • 化学工学一般
  • 電気化学

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